故障分析，又称为故障诊断，是指为了确定故障原因以及如何防止其再次发生而收集和分析数据的过程。故障分析乃是制造行业众多分支之中的一门重要学科。例如，在电子行业，新产品开发和已有产品改进时的重要手段就是故障分析。在故障分析过程中，需要采用各种各样的方法和手段，收集故障部分的数据和信息，以便用于故障原因（一种或多种）的后续分析。
参见
*因果关系
*因果链
*根本原因
*根本原因分析
*失效模式与影响分析 (FMEA)
*五个为什么
*故障率
*工程技术鉴定
*显微镜
*材料科学
*样品制备设备
*事故分析
*特性描述 (材料科学)
参考文献
#[http://www.crystec.com/trianae.htm Failure analysis of integrated circuits]
#[https://web.archive.org/web/20090206020043/http://wdsglobal.com/news/whitepapers/20060717/20060717.asp Subject reference]
#[http://www.auditmypc.com/acronym/NFF.asp Reference to the terminology]
#[http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?tp=&arnumber=713480&isnumber=15426 Article on the subject at IEEE archive]
#[https://web.archive.org/web/20051214155340/http://www.nenastran.com/newnoran/conferencePaper2/08_CPFiniteElementImplementationAdvancedFailureCriteriaComposites.pdf Finite Element Implementation of Advanced Failure Criteria for Composites]
参考书目
Martin, Perry L., Electronic Failure Analysis Handbook*, McGraw-Hill Professional; 1st edition (February 28, 1999) ISBN 0-07-041044-5.
*Microelectronics Failure Analysis, ASM International; Fifth Edition (2004) ISBN 0-87170-804-3
*[https://web.archive.org/web/20061215011105/http://www.ultratecusa.com/PDFlibrary/MW%20NOV03l.pdf Article from MATERIALS WORLD Journal discussing the various sample preparation disciplines that allow for failure analysis of electronic materials and components]
*[http://www.acceleratedanalysis.com/LC_hotspotdetection_procedure.htm Article discussing Liquid Crystal Hot-spot detection techniques]
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