Intel Core i3處理器列表

Intel Core i3 是「Core i品牌」四個子系列之一。

從Sandy Bridge微架構開始，Intel把微架構和代號改成相同名字。

桌上型處理器
Westmere微架構
"Clarkdale" (32 nm)
Sandy Bridge微架構
"Sandy Bridge" (32 nm)
Ivy Bridge微架構
"Ivy Bridge" (22 nm)
Haswell微架構
"Haswell-DT" (22 nm)
Skylake微架構
"Skylake-S" (14 nm)
Kaby Lake微架構
"Kaby Lake-S" (14 nm)
Coffee Lake微架構
"Coffee Lake-S" (14 nm)
"Coffee Lake-H" (14 nm)
Comet Lake微架構
移動型處理器
Westmere微架構（第一代）
"Arrandale" (MCP, 32 nm)
所有型號支援: MMX,SSE,SSE2, SSE3,SSSE3,SSE4.1, SSE4.2, EIST, Intel 64, XD bit, Intel VT-x,超執行緒,Smart Cache.*

• 整合Intel HD Graphics

Sandy Bridge microarchitecture (2nd generation)
"Sandy Bridge" (32 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, Smart Cache, Intel Insider.
• Core i3-2310E, Core i3-2340UE have support for ECC memory.
• Core i3-2310E, Core i3-2330E and Core i3-2340UE do not have support for Intel Insider
• Transistors: 624 million
• Die size: 149 mm²

Ivy Bridge microarchitecture (3rd generation)
"Ivy Bridge" (22 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, Smart Cache, Intel Insider.
• Core i3-3120ME, i3-3217UE have support for ECC memory.
• Core i3-3120ME, i3-3217UE do not have support for Intel Insider.
• Core i3-3229Y supports AES-NI.
• Die size: 94 mm²

Haswell microarchitecture (4th generation)
"Haswell-MB" (22 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, Smart Cache.

"Haswell-ULT" (SiP, 22 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, AES-NI, Smart Cache.
• Core i3-4010U and higher also support Intel VT-d
• Transistors: 1.3 billion
• Die size: 181 mm²

"Haswell-ULX" (SiP, 22 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, AES-NI, Smart Cache.
• Transistors: 1.3 billion
• Die size: 181 mm²

"Haswell-H" (22 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, Smart Cache.
• Transistors: 1.3 billion
• Die size: 181 mm²
• Embedded models support ECC memory

Broadwell microarchitecture (5th generation)
"Broadwell-U" (14 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache, and configurable TDP (cTDP) down

Skylake microarchitecture (6th generation)
"Skylake-H" (14 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache.
• Transistors: TBD
• Die size: TBD
• Embedded models support ECC memory

"Skylake-U" (14 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache, and configurable TDP (cTDP) down (except 6006U)

Kaby Lake microarchitecture (7th generation)
"Kaby Lake-H" (14 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache.
• Transistors: TBD
• Die size: TBD
• Embedded models support ECC memory

"Kaby Lake-U" (14 nm)

• 全系列支援指令: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache, and configurable TDP (cTDP) down.

Ice Lake microarchitecture (10th generation)
Comet Lake microarchitecture (10th generation)
"Comet Lake-U" (dual-core, 14 nm)
"Comet Lake-Y" (dual-core, 14 nm)
Ice Lake微架构
"Ice Lake-U" (dual-core, 10 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4, AVX, AVX指令集, AVX-512, FMA指令集, 英特尔软件防护扩展, SpeedStep (SST), X86-64, XD bit (an NX位元 implementation), Intel VT-x, X86虚拟化, Intel睿频加速, 超執行緒, AES指令集, CPU缓存, 深度学习, and 热设计功耗 (cTDP).

"Ice Lake-Y" (dual-core, 10 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4, AVX, AVX指令集, AVX-512, FMA指令集, 英特尔软件防护扩展, SpeedStep (SST), X86-64, XD bit (an NX位元 implementation), Intel VT-x, X86虚拟化, Intel睿频加速, 超執行緒, AES指令集, CPU缓存, 深度学习, and 热设计功耗 (cTDP) (except 1000NG4).

Willow Cove microarchitecture (11th generation)
"Tiger Lake-UP3" (10 nm SuperFin)

• All models support: SSE4.1, SSE4.2, AVX2, AVX-512, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Smart Cache, DL Boost, Optane memory, GNA 2.0, IPU6 (except SRK08), TB4, and configurable TDP (cTDP).
• -RE models support ECC memory.

"Tiger Lake-UP4" (10 nm SuperFin)

• All models support: SSE4.1, SSE4.2, AVX2, AVX-512, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Smart Cache, DL Boost, Optane memory, GNA 2.0, IPU6, TB4, and configurable TDP (cTDP).

參考資料
外部連結

• [http://ark.intel.com/ Intel 產品規格資料庫]